Specialists in Printed Circuit Manufacture

Specialists in printed circuit board manufacturing


		TAKE OUR TOUR Find out more about Garner Osborne's PROTOTYPE PCB DESIGN AND ASSEMBLY.

QUALITY PCB MANUFACTURERS

Thermal Management

for High Power and Densely Packed PCBs

Garner Osborne Circuits can offer this as an additional service.

The need to pack higher powered components closer together in smaller spaces, means higher watt densities - this translates into increased heat which could impair the reliability and functionality of an electronic system. With this problem in mind, Thermagon Inc. have introduced a thermally conductive, electrically insulating pre-preg system called 'T-preg'. The T-preg dielectric has made possible the use of metal-based materials as heat spreaders.

T-PREG PERFORMANCE PROPERTIES
Thermal Conductivity	5 W/m° C
Dielectric strength	800 V/mil
Dielectric constant	4.2 @ 1Khz
Lap shear AL/AL psi	1400
Peel strength Cu foil	6 pli min
Water absorbweight %	0.10*
Hardness, Shore D	76
Flexural strength	50
Elongation %	0.51
Copper weight avail	0.5 - 6oz
Continuous use temp	130°C
Intermittent use temp	250°C
Shelf life °C/months	20/6
Colour	Green
*After 168 hours

ALUMINIUM SUBSTRATES FOR HEAT MANAGEMENT

Aluminium - Most common because of its excellent conductivity, light weight and lower cost.

COPPER CORE SUBSTRATES FOR THERMAL MANAGEMENT

AND EMC PROTECTION

Copper - Used for its very high thermal conductivity and complete compatibility with existing printed circuit board chemistry.

METAL BASE-PLATE PROPERTIES

Base-plate Material	Thermal Expansion Coefficient ppm/C	Thermal Conductivity Z axis Watts/metre C	Thermal Resistance 1.6 Thk c-in 2/watt
Aluminium	24	173	0.0143
Copper	18	260	0.0095
Copper invar copper	5	50	0.05

Our standard turnaround time for the manufacture of PCBs is 10 days - however, we can turn around an order within 24 hours when customers require this service. All enquiries are welcome - you can request fast PCB quotes, or e-mail us to request a copy of our brochure.

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