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Mike Garner

Managing Director at Garner Osborne Circuits Ltd

How is Surface Mount Technology opening up new opportunities?

When speed is of the essence surface mount technology can offer an invaluable solution.

With the ability to place up to 10,000 components per hour, surface mount technology can offer a speedy production option. But speed isn’t the only benefit of surface mount technology.

What is surface mount technology?

Surface mount technology is by far the most popular approach to PCB assembly today.
Its popularity, helped by the benefits of convenience, speed and reliability means that many of today’s PCBs rely on SMT Technology.

What’s more, this clever solution has meant that the intricate task of pre-forming cables to connect components to PCBs could largely be relegated to the past.

However, SMT isn’t all about speed and convenience.

There are many other benefits to using SMT in PCB manufacture.

Today, where there’s a constant pressure for smaller, more versatile devices that offer increasing capabilities, SMT opens up a whole new realm of opportunity in product design. Here are 5 of the key benefits of using surface mount technology.

1. Minimise your PCBs
SMT allows for the use of smaller components and more of them than traditional cabled connections would allow for – perfect in light of constant demand for smaller PCBs for smaller devices.

2. Enhanced capabilities for your circuit boards
SMT allows for more connections per component too, which gives PCB designers greater feature design freedom and opportunities.

3. Improve reliability
Components rigidly fixed to the PCB can be placed with finer accuracy than traditional methods allow, enhancing the reliability of the units, and in turn the finished product.

4. Optimise the board space you have
SMT also enables you to make more of valuable composite board real estate by placing components on both sides of the board, reducing the size of the SMD (surface mounted device) and also reducing the amount of composite board required.

5. Reduce interference

Component characteristics can be more predictable with fewer RF signal effects than results from cabled components.

At Garner Osborne, we use state-of-the-art technology to manufacture micro-BGAs (ball grid arrays) that can offer a greater number of interconnection pins than traditional dual in-line packages. So, not only does SMT enable us to create your PCBs faster, but it means we can offer you more design possibilities too.
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