We adopt type IV solder paste as standard on all our circuitry
Once upon a time, electrical products were bulkier. Circuit boards were larger and stencil apertures wider.
As electronic devices reduce in size, the demand for more intricate layouts on smaller printed circuit boards has increased. A smart design can take you a fair way to effective electronic circuitry, but as stencil apertures and pad dimensions reduce, a greater degree of precision is required.
At Garner Osborne we don’t believe in achieving just-good-enough when we know we can do better. We have an embedded culture of using the right tools for the job. The right boards to withstand the environment that they will perform within, and the right components to ensure complete reliability of our circuitry. That’s why we adopt type IV solder paste as standard on all our circuitry.
The difference between Type III and Type IV solder paste
Where type III solder particles have a wider diameter of 25-45 microns, precise control over intricate solder paths can be more difficult. Our 100% PCB accuracy rate isn’t just down to our attention to the components we use though. Each of our PCBs go through rigorous and thorough testing at various stages of the production processes.